SpeedXPCB Introduces Advanced HDI Manufacturing Capabilities
SpeedXPCB announces major expansion of HDI manufacturing capabilities with advanced laser drilling and sequential lamination technology for high-density PCB applications.
SpeedXPCB Introduces Advanced HDI Manufacturing Capabilities
SpeedXPCB announces major expansion of HDI manufacturing capabilities with advanced laser drilling and sequential lamination technology for high-density PCB applications.
SpeedXPCB Introduces Advanced HDI Manufacturing Capabilities
Expanding Technology Leadership in High-Density PCB Manufacturing
Shanghai, China - January 2025 - SpeedXPCB, a leading provider of high-quality PCB manufacturing services, today announced the expansion of its High-Density Interconnect (HDI) manufacturing capabilities with the installation of state-of-the-art laser drilling equipment and sequential lamination systems.
New HDI Capabilities
Advanced Laser Drilling Technology
Our new laser drilling systems enable:
- Microvia diameters as small as 50ฮผm (2 mils)
- Aspect ratios of 0.8:1 for optimal reliability
- Precision placement with ยฑ25ฮผm accuracy
- High throughput processing for volume production
Sequential Lamination Excellence
The upgraded lamination capabilities include:
- 1+N+1 to 3+N+3 HDI structures
- Any-layer HDI for maximum routing flexibility
- Controlled impedance within ยฑ5% tolerance
- Advanced materials including low-loss dielectrics
Market Response to Growing Demand
The expansion comes in response to increasing demand from customers in:
- 5G Infrastructure: Base stations and network equipment
- Mobile Devices: Smartphones and tablets requiring miniaturization
- Automotive Electronics: ADAS and electric vehicle systems
- IoT Applications: Sensors and wearable devices
"Our customers are pushing the boundaries of what's possible with electronic design," said Dr. Sarah Chen, CTO of SpeedXPCB. "This investment ensures we can support their most challenging HDI requirements while maintaining our commitment to quality and delivery."
Quality and Certification
Industry-Leading Quality Standards
- IPC Class 3 capability for high-reliability applications
- ISO 9001:2015 certified quality management
- IATF 16949 automotive quality certification
- UL certification for safety compliance
Advanced Testing Capabilities
- Microsection analysis for via quality verification
- Electrical testing with flying probe and in-circuit test
- Reliability testing including thermal cycling and vibration
- Dimensional inspection using automated optical systems
Technology Partnership Program
SpeedXPCB is launching a Technology Partnership Program to support customers developing HDI designs:
Design Support Services
- Free DFM analysis for HDI designs
- Stackup optimization consulting
- Signal integrity simulation support
- Cost optimization recommendations
Prototyping Benefits
- Fast turnaround: 5-day prototypes for HDI boards
- No setup fees for initial prototype orders
- Design iteration support with engineering feedback
- Volume transition planning and pricing
Environmental Commitment
The new HDI manufacturing line incorporates environmental best practices:
- Energy-efficient laser systems reducing power consumption
- Waste reduction through optimized processing
- Chemical recycling programs for process chemicals
- RoHS compliance for all manufacturing processes
Customer Success Stories
5G Infrastructure Leader
A major telecommunications equipment manufacturer reduced their board size by 40% while improving signal integrity using SpeedXPCB's HDI technology.
Automotive Innovation
An electric vehicle startup achieved 60% weight reduction in their battery management system through HDI miniaturization.
Medical Device Breakthrough
A medical device company enabled a 50% smaller implantable device using SpeedXPCB's advanced HDI capabilities.
Investment in the Future
This $2.5M investment demonstrates SpeedXPCB's commitment to technology leadership:
- Equipment upgrades with latest-generation systems
- Facility expansion to accommodate growing demand
- Staff training on advanced HDI processes
- R&D investment in next-generation technologies
About SpeedXPCB
Founded in 2018, SpeedXPCB has established itself as a trusted partner for high-quality PCB manufacturing. With facilities in Shanghai and Shenzhen, the company serves customers worldwide across automotive, telecommunications, medical, and consumer electronics industries.
The company's commitment to quality, innovation, and customer service has earned recognition as a preferred supplier for leading technology companies globally.
Contact Information
For more information about SpeedXPCB's HDI capabilities:
- Website: www.speedxpcb.com
- Email: sales@speedxpcb.com
- Phone: +86-21-1234-5678
Media Contact
Jennifer Wang, Marketing Director Email: media@speedxpcb.com Phone: +86-21-1234-5679
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